Xiaomi Unveils New In-House Smartphone Chip

Xiaomi has introduced its new Xring O3 smartphone processor, a move that highlights the Chinese manufacturer’s continued efforts to decrease its dependence on third-party chip suppliers. The development also underscores Xiaomi's ambition to expand its influence within the highly competitive premium and foldable smartphone categories.

The processor was unveiled during Xiaomi’s Xring Chip Technology Communication Conference. Built on a 3nm process, the chip reportedly features over 24 billion transistors, representing a 26% increase compared to its predecessor. It is the first mobile processor to offer support for LPDDR6 memory, reaching speeds of 10,667Mb/s and a bandwidth of 113.8GB/s—a 48% improvement over the Xring O1. Additionally, the chip is designed to deliver a latency of 82 nanoseconds and a 45% boost in AI performance, supported by two CPU AI acceleration units and eight neural-network GPU accelerators.

TSMC has been tapped to manufacture the new 3nm chip, with Xiaomi setting an initial shipment target of 200,000 to 300,000 units. Rumors suggest the processor will debut in Xiaomi’s next flagship foldable device and the Xiaomi Pad 9 Pro Max. This latest launch follows the Xring O1, which was released in May 2025; Xiaomi reports that total shipments for devices utilizing the Xring O1 have now surpassed 1 million units, with approximately 150,000 smartphones sold since that initial launch.