Microsoft Unveils First Lakefield Device and New Surface Lineup

At a launch event in New York, Microsoft previewed the Surface Neo, a device co-engineered with Intel. The dual-screen device will be powered by the processor, code-named “Lakefield,“ that features an architecture combining a hybrid CPU with Intel’s Foveros 3D packaging technology.

“The innovation we’ve achieved with Lakefield gives our industry partners the ability to deliver on new experiences, and Microsoft’s Neo is trailblazing a new category of devices. Intel is committed to pushing the boundaries of computing by delivering key technology innovations for partners across the ecosystem,“ said Gregory Bryant, Intel executive vice president and general manager of the Client Computing Group.

Surface Neo is the culmination of deep engineering collaboration between two companies to drive innovation in new form factors, such as dual-screen devices. It exemplifies the shared vision of advancing the PC industry by delivering remarkable new usages and experiences without compromising on performance, design and the full Windows experience.

Lakefield achieves a significant reduction in package area, 12x12x1 mm, that is necessary for pushing the limits of form factor design. Its hybrid CPU architecture combines power efficient “Tremont“ cores with a performance scalable “Sunny Cove“ core to deliver computing performance and next-generation graphics at low power for long battery life. Lakefield is symbolic of the strategic shift in Intel’s design and engineering model that underpins the company’s future product roadmaps.

In addition, Microsoft announced new Surface devices based on 10th Gen Core processors, the Surface Pro 7 and the Surface Laptop 3. Surface Pro 7 is an ultralight 2 in 1 that offers laptop-to-tablet versatility with a 12.3″ touchscreen. Surface Laptop 3 delivers style and speed in 13.5“ and 15“ touchscreen display options, as well as new colors and finishes.