Ericsson Makes Large Step Towards Open RAN Industrialization
Ericsson committed to introducing compatibility for open fronthaul across its cloud RAN and radio portfolio starting in 2024.
Ericsson committed to introducing compatibility for open fronthaul across its cloud RAN and radio portfolio starting in 2024.
The Bosch fuel-cell power module is in volume production.
Intel announced Thunderbolt 5, the next generation of Thunderbolt, and demonstrated a prototype laptop and dock.
Fujifilm and IBM announced the development of a 50TB native tape storage system, featuring the world's highest native data tape cartridge capacity.
Bosch is now starting the production of new powertrain solutions based on 800-volt technology.
Lenovo announced several new products and solutions at its annual holiday product launch at IFA Berlin.
At this year’s Hot Chips event, Intel provided the first in-depth look at its next-generation Xeon product lineup.
SoftBank teamed with the US battery maker Enpower Greentech to develop an all-solid-state battery cell with a lithium metal anode.
Qualcomm announced the all-new Snapdragon G Series handheld gaming portfolio, built to meet the unique performance and feature demands of dedicated gaming devices.
Samsung completed the development of the industry’s first Graphics Double Data Rate 7 (GDDR7) DRAM.
Qualcomm unveiled its new chipset targeted at the value end of the smartphone market.
The Aurora supercomputer at Argonne National Laboratory is now fully equipped with all 10,624 compute blades, boasting 63,744 Intel Data Center GPU Max Series and 21,248 Xeon CPU Max Series processors.
Nokia and its partners announced the successful completion of Europe’s first live hybrid quantum encryption key trial with Proximus.
Intel announced the release of its newest quantum research chip, Tunnel Falls, a 12-qubit silicon chip.
IBM announced a new breakthrough, published on the cover of the scientific journal Nature.
Intel is the first in the industry to implement backside power delivery on a product-like test chip, achieving higher performance.
IBM announced plans to open its first Europe-based quantum data center to facilitate access to cutting-edge quantum computing for companies, research institutions, and government agencies.
SoftBank unveiled plans to power future data centers in Japan with Nvidia’s latest Arm-based AI chip.
With his first live keynote since the pandemic, NVIDIA founder and CEO Jensen Huang kicked off the COMPUTEX conference in Taipei.
Lenovo is installing a powerful high-performance computer (HPC) at the Potsdam Institute for Climate Impact Research (PIK), a world-leading research institution in its field.