Cineca signed an agreement with Lenovo for the installation of a new HPC system for the scientific community to research fusion energy.

The 64th edition of the TOP500 list reveals that El Capitan has achieved the top spot and is officially the third system to reach exascale computing after Frontier and Aurora.

ENEA, the Italian National Agency for New Technologies, Energy, and Sustainable Economic Development, has selected Lenovo for the installation of an HPC system at the Portici hub.

Nokia will lead a European Commission-supported project to explore how 6G can play a key role in building a sustainable future.

Denmark launched the country’s largest sovereign AI supercomputer.

Qualcomm unveiled the Snapdragon 8 Elite Mobile Platform, its most powerful and fastest mobile system-on-a-chip.

During the fifth test flight, SpaceX successfully landed the booster of its Starship.

MediaTek introduced its fourth-generation flagship chipset Dimensity 9400.

AMD  launched the latest high-performance computing solutions, including 5th Gen EPYC server CPUs, Instinct MI325X accelerators, Pensando Salina DPUs, Pensando Pollara 400 NICs, and Ryzen AI PRO 300 series processors for enterprise AI PCs.

Geoffrey Hinton used the receipt of a Nobel prize to reiterate fears over the potential for AI to run amok.

TSMC is moving to production with NVIDIA’s computational lithography platform, called cuLitho.

Canon shipped its brand-new lithography system for chip manufacturing to a Texas-based semiconductor consortium.

Samsung developed the industry’s first PCIe 4.0 automotive SSD based on eighth-generation vertical NAND (V-NAND).

T-Mobile US trialed the first wireless emergency alert sent via satellite.

Integrating holographic calls directly into dialer apps would allow users to access and utilize this advanced communication technology seamlessly without the need for additional applications.

Ahead of IFA 2024, Qualcomm announced the expansion of its Snapdragon X Series portfolio.

Bosch Smart Home celebrates the centennial of the IFA in Berlin with the presentation of a new product line that further enhances the smart home experience.

Rimac's SineStack incorporates game-changing power conversion technology that is highly integrated both physically and functionally with its battery cells.

Qualcomm unveiled the Snapdragon 7s Gen 3 mobile chipset.