Samsung Begins Shipment of Its Latest HBM Chip Samples

Samsung announced that it has begun shipping the industry’s first 12-layer HBM4E samples to major global customers. Following the first mass production and commercial shipment of HBM4 earlier this year, Samsung now extends its HBM roadmap with the introduction of HBM4E samples.

Sang Joon Hwang, head of memory development at Samsung, said that the company had once again demonstrated its distinct technological edge with HBM4E. “Through our advanced manufacturing capabilities and pre-emptive infrastructure investments, we will continue to drive the growth of the global AI memory market.”

The company noted that the chip delivers a stable pin speed of 14Gb/s, a 20% increase over the HBM4. The rate of the latest product can be scaled up to 16Gb/s to support increasingly intensive data processing requirements. It added that its comprehensive portfolio, spanning memory, foundry, logic design, and advanced packaging, meant it would be able to continue to ensure a stable semiconductor supply for the booming AI market.

Along with peers, Samsung has been reaping the rewards of high demand and associated price rises for memory chips driven by global demand for AI systems. The company reported record quarterly sales for its memory business in Q1, attributed to addressing high-value-added AI demand despite limited supply availability.