At the G7 Summit in Japan, IBM announced a 10-year, $100 million initiative with the University of Tokyo and the University of Chicago to develop a quantum-centric supercomputer powered by 100,000 qubits.

Lenovo announced it is working with the Leibniz Supercomputing Centre (LRZ) to build Europe’s first High-Performance Computer (HPC) prototype as part of an innovation partnership.

MediaTek announced the Dimensity 9200+, its upgraded chipset targeted at flagship 5G devices.

Bosch Engineering and Ligier Automotive have established a strategic partnership for developing high-performance hydrogen engine vehicles.

Qualcomm announced new IoT solutions to enable the advancement of next-generation devices.

Fundación Ikerbasque, the Basque Foundation for Science in the Basque Country of Spain, and IBM  presented details of how they are partnering to further establish the Basque Country as a leading technology hub.

Samsung unveiled its first ultra-wideband (UWB) chipset combining highly accurate location tracking capability and security.

Qualcomm announced the first integrated 5G IoT processors that are designed to support four major operating systems, in addition to two new robotics platforms, and an accelerator program for IoT ecosystem partners.

Qualcomm announced a mobile chipset bringing some of its high-end flagship features into its Snapdragon 7-series.

Bosch is actively involved in projects, alliances, and initiatives at both the national and international levels to lay important foundations for 6G technology.

Xiaomi recently presented a new solid-state battery technology.

After launching its beta version in September 2022, Intel released version 1.0 of the Quantum Software Development Kit (SDK) last week.

Samsung has secured standardized 5G non-terrestrial networks (NTN) modem technology for direct communication between smartphones and satellites, especially in remote areas.

MediaTek expanded its 5G chipset range with the introduction of the first processor in its new Dimensity 7000 series.

Qualcomm announced the Snapdragon X75, the first chipset for the 5G-Advanced platform.

Qualcomm announced Snapdragon X35 5G Modem-RF System, the world’s first 5G NR-Light modem-RF system.

After automated valet parking has been approved for commercial use in the P6 parking garage at Stuttgart airport, Bosch and APCOA are branching out and installing the technology in 15 further parking garages in Germany.

The IBM Institute for Business Value (IBV) has published its Security in the Quantum Era report.

Samsung introduced its latest 200-megapixel (MP) image sensor, the ISOCELL HP2, with improved pixel technology and full-well capacity for stunning mobile images in tomorrow’s premium smartphones.

During CES in Las Vegas, Intel announced its 13th Gen Core mobile processors.

New GeForce RTX GPUs, a new generation of hyper-efficient laptops, Omniverse capabilities, and partnerships across the automotive industry were highlights of a news-packed NVIDIA address at the CES trade show in Las Vegas.

Lisa Su, CEO, and Chair of AMD unveiled the company’s Ryzen 7040 series processor during her keynote address at CES 2023.

At CES in Las Vegas, Qualcomm unveiled its latest chipset, Snapdragon Ride Flex SoC.

Samsung announced the development of its 16-gigabit (Gb) DDR5 DRAM built using the industry’s first 12-nanometer (nm)-class process technology.

Qualcomm debuted its latest IoT modem.

As the autonomous vehicle industry enters the next year, it will start navigating into even greater technology frontiers.

Bosch and Mercedes-Benz have reached an important milestone on the way to automated driving. Germany’s Federal Motor Transport Authority (KBA) has approved their highly automated parking system for use in the P6 parking garage run by APCOA at Stuttgart Airport.

Deutsche Telekom, BMW, Valeo, Ericsson, and Qualcomm announced the world's first demonstration of an automated driving application supported by 5G Standalone (SA) network slicing with controlled network features for Quality of Service (QoS).

The European Commission together with the European High-Performance Computing Joint Undertaking (EuroHPC JU), the Italian Ministry of Universities and Research, and the CINECA consortium inaugurated Europe's latest supercomputer.

Qualcomm announced its new AR chipset developed for use in smart glasses.