Qualcomm launched the new QCS400 SoC series.
Siemens has added a new generation of high-end IPCs to its portfolio of industrial PCs.
Qualcomm announced that it is bringing the company’s AI expertise to the cloud with the Qualcomm Cloud AI 100.
Sony announced that it has succeed in developing Pregius S, a stacked CMOS image sensor technology.
Samsung announced that it has developed a 3rd-generation 10-nanometer-class 8 Gb DDR4 DRAM for the first time in the industry.
Tokić, a leading Croatian car-parts retailer, has partnered with robotics and AI company Gideon Brothers to deploy autonomous mobile robots in its logistics and distribution center.
Stanford Medicine reported results of the Apple Heart Study, the largest study ever of its kind.
Samsung announced that it has begun mass producing the highest-capacity mobile DRAM, the industry’s first 12-gigabyte low-power double data rate 4X (LPDDR4X) package.
Intel and the U.S. Department of Energy will deliver the first supercomputer with a performance of one exaFLOP in the United States.
At the European Congress of Radiology, Samsung showcased its latest diagnostic imaging medical equipment and AI-based solutions.
Intel, Alibaba, Cisco, Dell EMC, Facebook, Google, HPE, Huawei and Microsoft announced the founding of a consortium to develop Compute Express Link.
IBM researchers have created a new technology called VolCat, a catalytic chemical process that can turn PET into a renewable resource.
Samsung announced that it has begun mass producing the industry’s first 512-gigabyte embedded Universal Flash Storage 3.0 for next-generation mobile devices.
IBM unveiled a new scientific milestone, announcing its highest quantum volume to date.
Intel announced that it contributed the protocol specification to the USB Promoter Group, enabling other chip makers to build compatible silicon, royalty-free.
At MWC19 in Barcelona, Huawei showcased the 5G CPE Pro, the CPE (Customer Premise Equipment) that provides ultra-high speed broadband and intelligent Dual-Link features.
SEAT and IBM announced the development of a new solution designed to transform driving in cities.
Zyxel announced the expansion of its Fixed Wireless Access and In-Building Solutions.
Intel announced it will provide technology to internet services provider Rakuten for a new cloud-native network.
IBM announced a new chapter in the journey from AI experimentation to wide-scale deployment and industry transformation.
Samsung introduced its smallest high-resolution image sensor, the ISOCELL Slim 3T2. The chip is expected to be in mass production in the first quarter of this year.
In partnership with Arsenal FC, Liverpool FC and Manchester City, Intel will deliver immersive experiences via True View at Emirates Stadium, Anfield and the Etihad Stadium.
Samsung announced that it has begun mass producing the industry’s first one-terabyte embedded Universal Flash Storage (eUFS) 2.1, for use in next-generation mobile applications.
Juniper Research has drawn up a list of predictions for 2019, all neatly wrapped up as the top trends for the technology industry.
Samsung introduced its latest innovations in modular Micro LED display technology during its annual First Look CES event.
At CES in Las Vegas, Intel made several announcements spanning PCs and new devices to diverse growth segments including AI, 5G and autonomous driving.
At CES, Bosch Sensortec announced the BML100PI, an Interactive Projection Module that enriches smart homes with a virtual touchscreen on every surface, turning ordinary shelves into personal assistants.
Huawei announced the industry's highest-performance ARM-based CPU, Kunpeng 920.
Qualcomm announced its next-generation modem purpose-built for IoT applications.
Moscow government is launching a smart district that will become a living lab for piloting smart technologies in the city.
© 2016 ictbusiness.biz
Do you have an interesting story related to technology and business, and want to make a guest post? Contact us!
We are open for publishing guest posts which have useful informations and opinions for our readers.
You can send your articles to e-mail email@example.com .
Web portal ICTbusiness.biz is a member of Croatian independent software exporters association CISEx
Web design and development: Webmaster.hr