At Intel's 2019 Investor Meeting, Murthy Renduchintala, company’s chief engineering officer and group president of the Technology, Systems Architecture and Client Group, announced that the company will start shipping its volume 10nm client processor in June. He also shared first details on the company’s 7nm process technology.
Renduchintala said Intel has redefined its product innovation model for the data-centric era of computing, which “requires workload-optimized platforms and effortless customer and developer innovation.“ He shared expected performance gains resulting from a combination of technical innovations across six pillars, process and packaging, architecture, memory, interconnect, security and software, giving insight into the design and engineering model steering the company’s product development.
“While process and CPU leadership remain fundamentally important, an extraordinary rate of innovation is required across a combination of foundational building blocks that also include architecture, memory, interconnect, security and software, to take full advantage of the opportunities created by the explosion of data,“ Renduchintala said.
Intel’s first volume 10nm processor, a mobile PC platform code-named Ice Lake, will begin shipping in June. It will take full advantage of 10nm along with architecture innovations. It is expected to deliver approximately 3 times faster wireless speeds, 2 times faster video transcode speeds, 2 times faster graphics performance, and 2.5 to 3 times faster AI performance over previous generation products.
Renduchintala provided first updates on Intel’s 7nm process technology. It will mark the company’s first commercial use of extreme ultraviolet lithography. The lead 7nm product is expected to be an Xe architecture-based, general-purpose GPU for data center AI and high-performance computing. It is expected to launch in 2021.
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