At the Mobile World Congress 2024, Deutsche Telekom will showcase a visionary AI phone concept, developed in collaboration with Qualcomm and Brain.ai.
Qualcomm announced the Snapdragon 7 Gen 3 Mobile Platform. The upgraded platform is expected to bring features from high-end devices to a lower-priced segment. It will be initially adopted by key OEMs including HONOR and vivo, and the first commercial device is expected to be announced later this month.
The new Snapdragon delivers across-the-board advancements in AI, mobile gaming, camera, and 5G connectivity. It is fully equipped to enable new use-cases including up to 2.63GHz peak CPU speeds, over 50% faster GPU performance, and 60% improved AI performance per watt while still delivering incredible power efficiency.
“Intelligently designed to balance performance and power efficiency, the Snapdragon 7 Gen 3 Mobile Platform delivers a selection of premium experiences that are brand new to the Snapdragon 7-series,” said Christopher Patrick, senior vice president and general manager of mobile handsets at Qualcomm. “By working closely with our OEM partners, we’re able to help make the next generation of in-demand features, such as enhanced AI and extraordinary camera capabilities, more widely accessible to consumers.”