DT’s nuSIM Is Now Integrated on First Qualcomm Chipset

DT’s nuSIM Is Now Integrated on First Qualcomm Chipset

Deutsche Telekom, together with Qualcomm, Quectel and Redtea Mobile, are introducing their implementation of nuSIM, the integrated SIM for the IoT. nuSIM removes the physical SIM, a perfect fit for mobile IoT applications when cost- and power-efficiency is paired with unique design advantages are important factors.

“The nuSIM initiative was introduced by Deutsche Telekom at the beginning of last year and quickly adopted by leading IoT industry players around the world,” says Rami Avidan, responsible for IoT at Deutsche Telekom. “Meanwhile, it has moved from concept stage to real implementations from various partners. This is another exciting step forward, as nuSIM will bring important cost and design benefits to our IoT device partners.”

For the first time, the nuSIM functionality is now fully integrated on a Qualcomm chipset. The joint solution has been developed in accordance with DT's open nuSIM specification. It consists of a nuSIM operating system from Redtea Mobile in a Quectel BG95-M3 module which contains a Qualcomm 9205 LTE Modem.

nuSIM is an integrated SIM solution dedicated to the specific needs of the IoT market. It makes the usual SIM component obsolete by moving the SIM function into the chipset. This creates benefits for the device's bill of material, power consumption and overall design. Mobile operator data is added in a secure process at the time of module or device manufacturing. The end customer gets instant connectivity without any additional steps. Commercial availability of nuSIM is planned for later in 2020.

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