Bosch in North America and Astrobotic Technology announced a research partnership to send experimental sensor technology to the International Space Station (ISS) as early as May 2019.

Bosch supports service technicians by means of innovative Augmented Reality applications.

The High-Performance Computing Center of the University of Stuttgart (HLRS) and HPE announced a collaboration to build and deliver a next-generation supercomputer.

Samsung announced its latest premium application processor, the Exynos 9 Series 9820, equipped for on-device AI applications.

Einride, Ericsson and Telia are putting 5G into motion at a DB Schenker facility in Jönköping, Sweden.

Hewlett Packard Enterprise announced it is opening high-performance computing capabilities to astronauts on the International Space Station as part of its continued experiments on the Spaceborne Computer project.

The Volkswagen Group, Mobileye and Champion Motors announced plans to deploy Israel’s first self-driving ride hailing service, or Mobility-as-a-Service, starting next year.

Samsung announced that it has completed all process technology development and has started wafer production of its process node, 7LPP, the 7-nanometer LPP with EUV lithography technology.

Samsung announced several additions to its semiconductor ecosystem that encompass next-generation technologies in foundry as well as NAND flash, SSD and DRAM.

AQUIAS, a project conducted by Bosch, Fraunhofer Institutes, and ISAK, offers insights on the future of work quality through work-sharing between service robots and workers with or without severe disabilities.

As part of its revised strategy, Swedish company myFC is intensifying its efforts within fuel cell integration into smartphones.

IBM Security announced the industry's first mobile Security Operations Center, capable of traveling onsite for cybersecurity training, preparedness, and response.

IBM introduced AI OpenScale, a new technology platform that addresses key challenges of artificial intelligence adoption.

Airtame, a Danish startup that produces a wireless HDMI solution for both the business and education sectors, has announced the launch of their second generation hardware product, Airtame 2.

IBM launched a new open technology designed to make it easier to manage, move and integrate apps across different cloud computing infrastructures.

Intel announced the 9th Gen Core i9-9900K, its best gaming processor, and said preorders for the new processor already begun.

HP launched Metal Jet, the world’s most advanced 3D printing technology for the high volume manufacturing of production-grade metal parts.

Intel announced additions to the 8th Gen Core processor family.

HPE announced it is building a new supercomputer for the National Renewable Energy Laboratory (NREL) that is more energy efficient and 3.5 times more powerful than its existing system.

Bosch is launching an electrical powertrain suitable for the vast majority of delivery vehicles.

Chinese tech giant Huawei introduced Kirin 980, the world's first 7nm process mobile phone SoC chipset.

Samsung held a press conference at IFA to outline its commitment to developing products and services that will shape the next era of connected living.

At this year's PACK EXPO International in Chicago, USA from October 14 to 17, Bosch Packaging Technology will present its new virtual reality planning tool "Virtual Layout".

HPE and PLDA announced a collaboration to meet the challenges of next-generation connectivity for advanced workloads.

Samsung announced that it has begun mass producing the industry’s first 4-bit 4 TB SATA SSD for consumers.

DeepMind, the London-based AI company owned by Alphabet, plans to develop a product that will help doctors to detect more than 50 sight-threatening conditions from a common type of eye scan, according to Bloomberg.

A total of 31 Bosch Training Centers worldwide support automotive workshops in keeping up with technical developments concerning vehicle servicing and repair.

Telefónica and SEAT have presented the first use case by equipping a both a vehicle and road infrastructure with technology enabling the exchange of information.

Audi and Ericsson announced plans to pioneer the use of 5G technology for automotive production.

Samsung announced that it has begun mass producing its fifth-generation V-NAND memory chips with the fastest data transfers now available.