Germany has opened the first stretch of an electric highway that will connect hybrid trucks to overhead wires, allowing them to recharge while traveling, according to Bloomberg.
At Intel's 2019 Investor Meeting, the company announced that they will start shipping its volume 10nm client processor in June.
Bosch is ready to be fully climate-neutral as early as next year, the company said in a press release.
As the technology industry talks up 5G cellular networks, Cisco says much of the promised revolution in connectivity will come from a more prosaic source: WiFi, according to Bloomberg.
Qualcomm announced that it has expanded its mobile roadmap in the 7 and 6 series to include the latest Snapdragon 730, 730G and 665 Mobile Platforms.
Intel launched the most powerful generation of its Core mobile processors ever.
Qualcomm launched the new QCS400 SoC series.
Siemens has added a new generation of high-end IPCs to its portfolio of industrial PCs.
Qualcomm announced that it is bringing the company’s AI expertise to the cloud with the Qualcomm Cloud AI 100.
Sony announced that it has succeed in developing Pregius S, a stacked CMOS image sensor technology.
Samsung announced that it has developed a 3rd-generation 10-nanometer-class 8 Gb DDR4 DRAM for the first time in the industry.
Tokić, a leading Croatian car-parts retailer, has partnered with robotics and AI company Gideon Brothers to deploy autonomous mobile robots in its logistics and distribution center.
Stanford Medicine reported results of the Apple Heart Study, the largest study ever of its kind.
Samsung announced that it has begun mass producing the highest-capacity mobile DRAM, the industry’s first 12-gigabyte low-power double data rate 4X (LPDDR4X) package.
Intel and the U.S. Department of Energy will deliver the first supercomputer with a performance of one exaFLOP in the United States.
At the European Congress of Radiology, Samsung showcased its latest diagnostic imaging medical equipment and AI-based solutions.
Intel, Alibaba, Cisco, Dell EMC, Facebook, Google, HPE, Huawei and Microsoft announced the founding of a consortium to develop Compute Express Link.
IBM researchers have created a new technology called VolCat, a catalytic chemical process that can turn PET into a renewable resource.
Samsung announced that it has begun mass producing the industry’s first 512-gigabyte embedded Universal Flash Storage 3.0 for next-generation mobile devices.
IBM unveiled a new scientific milestone, announcing its highest quantum volume to date.
Intel announced that it contributed the protocol specification to the USB Promoter Group, enabling other chip makers to build compatible silicon, royalty-free.
At MWC19 in Barcelona, Huawei showcased the 5G CPE Pro, the CPE (Customer Premise Equipment) that provides ultra-high speed broadband and intelligent Dual-Link features.
SEAT and IBM announced the development of a new solution designed to transform driving in cities.
Zyxel announced the expansion of its Fixed Wireless Access and In-Building Solutions.
Intel announced it will provide technology to internet services provider Rakuten for a new cloud-native network.
IBM announced a new chapter in the journey from AI experimentation to wide-scale deployment and industry transformation.
Samsung introduced its smallest high-resolution image sensor, the ISOCELL Slim 3T2. The chip is expected to be in mass production in the first quarter of this year.
In partnership with Arsenal FC, Liverpool FC and Manchester City, Intel will deliver immersive experiences via True View at Emirates Stadium, Anfield and the Etihad Stadium.
Samsung announced that it has begun mass producing the industry’s first one-terabyte embedded Universal Flash Storage (eUFS) 2.1, for use in next-generation mobile applications.
Juniper Research has drawn up a list of predictions for 2019, all neatly wrapped up as the top trends for the technology industry.
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