Nokia is partnering with DOCOMO and NTT to jointly define and develop key technologies for 6G.

Oak Ridge National Laboratory’s (ORNL) Frontier system submitted its very first score to the Top500 list of 1.1 exaflops, making it the world’s fastest supercomputer and the first to break the exascale barrier.

The Leibniz Supercomputing Centre (LRZ), Cerebras Systems, and Hewlett Packard Enterprise announced the joint development and delivery of a new system.

Qualcomm announced its latest lineup of mobile platforms, Snapdragon 8+ Gen 1 and Snapdragon 7 Gen 1, to power the next generation of premium and high-tier Android smartphones.

BT Group began testing a quantum radio receiver technology.

Intel announced that Habana Labs, its data center team focused on AI deep learning processor technologies, launched its second-generation deep learning processors for training and inference.

Bosch is planning not only to use green hydrogen but also to be one of the companies producing it.

Samsung announced its new microSD card, the Samsung PRO Endurance.

Qualcomm announced its Wi-Fi 7 capable Networking Pro Series Gen 3 family of platforms.

Researchers at Intel and QuTech, an advanced quantum computing research center, have successfully created the first silicon qubits at scale at Intel’s D1 manufacturing factory in Hillsboro, Oregon.

IBM unveiled IBM z16, their next-generation system with an integrated on-chip AI accelerator delivering latency-optimized inferencing.

Intel announced full details and availability for the new 12th Gen Core i9-12900KS, the processor the company claims to be the world’s fastest desktop processor.

Intel has published the most significant update to industry power supply specifications since the initial ATX 2.0 specs were introduced in 2003.

Trimble and Qualcomm announced the availability of Trimble RTX GNSS technology for Snapdragon 8 Gen 1 and Snapdragon 888 Mobile Platforms.

The two-car hydrogen-powered trainset of the latest generation will be presented to the public this spring.

Xiaomi has been invited to participate in three research projects being convened by 3GPP, the 3rd Generation Partnership Project.

Hrvatski Telekom and Nokia completed a successful 25Gb/second fiber broadband trial of advanced 25G PON fiber technology in HT's Rijeka lab.

At MWC 2022, Huawei launched an all-new microwave solution for 50 Gbps E-band, intending to meet ultra-high-bandwidth needs in dense urban areas.

OPPO announced two breakthroughs in high-speed flash charging: 150W SUPERVOOC with Battery Health Engine (BHE) and 240W SUPERVOOC flash charge technology.

Meta CEO Mark Zuckerberg said the company is working on AI research to generate worlds through speech, improve how people chat to voice assistants, and translate between languages.

Benteler EV Systems, Beep, and Mobileye, announced a strategic collaboration to develop and deploy automotive-grade, fully electric, autonomous movers in public and private communities across North America.

The European Commission plans to invest €6 billion to develop a new satellite system.

The Government of Quebec and IBM entered a new partnership to further establish Quebec as a leading technology hub in the development of quantum computing, AI, semiconductors, and high-performance computing through the launch of the Quebec-IBM Discovery Accelerator.

Samsung introduced its new fingerprint security IC (integrated circuit) with enhanced security features.

Meta chose Nvidia's technologies for a new supercomputer designed to scale up and develop the next generation of AI technology.

AMD announced new additions to the Radeon PRO W6000 Series desktop and mobile workstation graphics lineup.

Vodafone, Qualcomm, and Thales joined forces to demonstrate a working smartphone featuring iSIM.

A team rolled in the first huge chipmaking tool at Intel's new plant Fab 34 in Ireland.

Samsung announced its new flagship mobile processor for smartphones Exynos 2200.

Samsung demonstrated the world’s first in-memory computing based on MRAM (Magnetoresistive Random Access Memory).