HP launched Metal Jet, the world’s most advanced 3D printing technology for the high volume manufacturing of production-grade metal parts.

Intel announced additions to the 8th Gen Core processor family.

HPE announced it is building a new supercomputer for the National Renewable Energy Laboratory (NREL) that is more energy efficient and 3.5 times more powerful than its existing system.

Bosch is launching an electrical powertrain suitable for the vast majority of delivery vehicles.

Chinese tech giant Huawei introduced Kirin 980, the world's first 7nm process mobile phone SoC chipset.

Samsung held a press conference at IFA to outline its commitment to developing products and services that will shape the next era of connected living.

At this year's PACK EXPO International in Chicago, USA from October 14 to 17, Bosch Packaging Technology will present its new virtual reality planning tool "Virtual Layout".

HPE and PLDA announced a collaboration to meet the challenges of next-generation connectivity for advanced workloads.

Samsung announced that it has begun mass producing the industry’s first 4-bit 4 TB SATA SSD for consumers.

DeepMind, the London-based AI company owned by Alphabet, plans to develop a product that will help doctors to detect more than 50 sight-threatening conditions from a common type of eye scan, according to Bloomberg.

A total of 31 Bosch Training Centers worldwide support automotive workshops in keeping up with technical developments concerning vehicle servicing and repair.

Telefónica and SEAT have presented the first use case by equipping a both a vehicle and road infrastructure with technology enabling the exchange of information.

Audi and Ericsson announced plans to pioneer the use of 5G technology for automotive production.

Samsung announced that it has begun mass producing its fifth-generation V-NAND memory chips with the fastest data transfers now available.

Samsung announced that it has successfully developed the industry’s first 10-nanometer, 8-gigabit LPDDR5 DRAM.

Corning rolled out new technology it says is less likely to break when a device is dropped, according to Bloomberg.

Bosch and Daimler are speeding up the development of fully-automated and driverless driving in the city and are decisively setting the course.

Hewlett Packard Enterprise announced that the Blue Brain Project selected HPE to build a next-generation supercomputer for modeling and simulation of the mammalian brain.

IBM recently announced FlashSystem 9100 all-flash arrays.

State-run Israel Aerospace Industries and non-profit SpaceIL announced plans to launch a lunar mission in December, putting Israel on track to become the fourth country to land on the moon, according to Bloomberg.

The Dubai Electricity and Water Authority (DEWA) announced plans to work with Microsoft to develop new quantum-based solutions to address energy optimization and other challenges.

Bosch Sensortec announced the BHI260 and BHA260, the first two members of a new generation of smart sensor hubs.

Samsung has launched the industry’s highest capacity NVMe solid state drive (SSD) based on the Next-generation Small Form Factor (NGSFF), an eight-terabyte (TB) NF1 SSD.

HPE announced collaboration with Sandia National Laboratories and the U.S. Department of Energy to deliver the world’s largest Arm supercomputer.

The U.S. has a new supercomputer and it’s twice as fast as the current record holder in China, according to Bloomberg.

Volocopter, a German startup backed by Intel and Daimler, has built a drone-like electric helicopter to ferry travelers across city skies, according to Bloomberg.

Micron and Intel have announced production and shipment of the industry’s first 4bits/cell 3D NAND technology.

Sony’s new PlayStation chief John Kodera said he sees a future in portable gaming, departing from his predecessor’s view that there’s a limited market for handheld games, according to Bloomberg.

New developments from Bosch could enable vehicle manufacturers to reduce emissions of nitrogen oxides (NOx) so drastically that they already comply with future limits.

Intel said it found another way to attack computers related to the chip security flaws announced earlier this year, according to Bloomberg.