Lenovo announced the new all-in-one VR headset engineered for the enterprise.

AMD unveiled the new Ryzen 7020 Series and Athlon 7020 Series Processor lineup.

European telecom operators Deutsche Telekom, Orange, Telefónica, and Vodafone, together with the deep tech company MATSUKO, have conducted a pilot to make holographic calls as easy and simple as making a straightforward phone call.

Arm, Intel, and Nvidia have jointly authored a paper describing an 8-bit floating point (FP8) specification and its two variants E5M2 and E4M3.

Intel and Broadcom showcased the industry’s first cross-vendor Wi-Fi 7 demonstration, with over-the-air speeds greater than 5 gigabits per second.

Siemens Mobility and Deutsche Bahn presented the H2goesRail project to the public in November 2020.

Qualcomm announced Snapdragon 6 Gen 1 and Snapdragon 4 Gen 1 Mobile Platforms for the mid-tier and mass-volume segment.

Samsung unveiled an array of next-generation memory and storage technologies during Flash Memory Summit 2022, held at the Santa Clara (California) Convention Center.

HPE announced that McMaster University’s McArthur Lab developed one of the fastest and most accurate software packages for determining COVID-19 variants, using the HPE Superdome Flex server.

Starting this week, customers across the US can see custom electric delivery vehicles from Rivian delivering their Amazon packages.

The unveiling of the first full-color image from the James Webb Space Telescope is already astounding and delighting humans around the globe. But humans aren’t the only audience for these images.

Samsung has started the initial production of its 3-nanometer (nm) process node applying Gate-All-Around (GAA) transistor architecture. Multi-Bridge-Channel FET (MBCFET), Samsung’s GAA technology implemented for the first time, defies the performance limitations of FinFET, improving power efficiency by reducing the supply voltage level, while also enhancing performance by increasing drive current capability.

Siemens Mobility has been commissioned by Niederbarnimer Eisenbahn (NEB) to deliver seven two-car Mireo Plus H trains for the Heidekrautbahn network (RB27) in the Berlin-Brandenburg metropolitan region.

Together with the Karlsruhe Institute of Technology (KIT) and BASF, Bosch has successfully produced the first-ever 3D-printed microreactor made of technical ceramics.

Nokia is partnering with DOCOMO and NTT to jointly define and develop key technologies for 6G.

Oak Ridge National Laboratory’s (ORNL) Frontier system submitted its very first score to the Top500 list of 1.1 exaflops, making it the world’s fastest supercomputer and the first to break the exascale barrier.

The Leibniz Supercomputing Centre (LRZ), Cerebras Systems, and Hewlett Packard Enterprise announced the joint development and delivery of a new system.

Qualcomm announced its latest lineup of mobile platforms, Snapdragon 8+ Gen 1 and Snapdragon 7 Gen 1, to power the next generation of premium and high-tier Android smartphones.

BT Group began testing a quantum radio receiver technology.

Intel announced that Habana Labs, its data center team focused on AI deep learning processor technologies, launched its second-generation deep learning processors for training and inference.

Bosch is planning not only to use green hydrogen but also to be one of the companies producing it.

Samsung announced its new microSD card, the Samsung PRO Endurance.

Qualcomm announced its Wi-Fi 7 capable Networking Pro Series Gen 3 family of platforms.

Researchers at Intel and QuTech, an advanced quantum computing research center, have successfully created the first silicon qubits at scale at Intel’s D1 manufacturing factory in Hillsboro, Oregon.

IBM unveiled IBM z16, their next-generation system with an integrated on-chip AI accelerator delivering latency-optimized inferencing.

Intel announced full details and availability for the new 12th Gen Core i9-12900KS, the processor the company claims to be the world’s fastest desktop processor.

Intel has published the most significant update to industry power supply specifications since the initial ATX 2.0 specs were introduced in 2003.

Trimble and Qualcomm announced the availability of Trimble RTX GNSS technology for Snapdragon 8 Gen 1 and Snapdragon 888 Mobile Platforms.

The two-car hydrogen-powered trainset of the latest generation will be presented to the public this spring.

Xiaomi has been invited to participate in three research projects being convened by 3GPP, the 3rd Generation Partnership Project.