After automated valet parking has been approved for commercial use in the P6 parking garage at Stuttgart airport, Bosch and APCOA are branching out and installing the technology in 15 further parking garages in Germany.

The IBM Institute for Business Value (IBV) has published its Security in the Quantum Era report.

Samsung introduced its latest 200-megapixel (MP) image sensor, the ISOCELL HP2, with improved pixel technology and full-well capacity for stunning mobile images in tomorrow’s premium smartphones.

During CES in Las Vegas, Intel announced its 13th Gen Core mobile processors.

New GeForce RTX GPUs, a new generation of hyper-efficient laptops, Omniverse capabilities, and partnerships across the automotive industry were highlights of a news-packed NVIDIA address at the CES trade show in Las Vegas.

Lisa Su, CEO, and Chair of AMD unveiled the company’s Ryzen 7040 series processor during her keynote address at CES 2023.

At CES in Las Vegas, Qualcomm unveiled its latest chipset, Snapdragon Ride Flex SoC.

Samsung announced the development of its 16-gigabit (Gb) DDR5 DRAM built using the industry’s first 12-nanometer (nm)-class process technology.

Qualcomm debuted its latest IoT modem.

As the autonomous vehicle industry enters the next year, it will start navigating into even greater technology frontiers.

Bosch and Mercedes-Benz have reached an important milestone on the way to automated driving. Germany’s Federal Motor Transport Authority (KBA) has approved their highly automated parking system for use in the P6 parking garage run by APCOA at Stuttgart Airport.

Deutsche Telekom, BMW, Valeo, Ericsson, and Qualcomm announced the world's first demonstration of an automated driving application supported by 5G Standalone (SA) network slicing with controlled network features for Quality of Service (QoS).

The European Commission together with the European High-Performance Computing Joint Undertaking (EuroHPC JU), the Italian Ministry of Universities and Research, and the CINECA consortium inaugurated Europe's latest supercomputer.

Qualcomm announced its new AR chipset developed for use in smart glasses.

Cerebras Systems unveiled Andromeda, a 13.5 million core AI supercomputer, now available and being used for commercial and academic work.

Qualcomm introduced Snapdragon 8 Gen 2 chipset which will power flagship smartphones.

Hrvatski Telekom's Data Center in Zagreb met the highest security, technological, and industrial standards and received a TIER III certificate from the UpTime Institute.

At a surprise session of the 90th INTERPOL General Assembly in New Delhi, the global police organization unveiled the first-ever Metaverse specifically designed for law enforcement worldwide.

Sierra Space, a commercial space company, and IBM, a technology leader within the space industry going back to the earliest days of the U.S. space program, announced the signing of a new Memorandum of Understanding (MOU).

Samsung announced that its latest LPDDR5X DRAM with the industry’s fastest speed of 8.5 gigabits per second (Gbps) was validated for use on Snapdragon mobile platforms.

Nokia announced the world’s first Generation 6 broadband platform, designed for a ‘fiber-for-everything’ world where fiber broadband networks evolve to become a single infrastructure for all services.

Samsung formed a 6G research group in the UK focused on developing next-generation network technology and devices.

The European Commission announced the creation of Hexa-X-II, the second phase of the EC’s 6G flagship initiative.

The European High-Performance Computing Joint Undertaking (EuroHPC JU) has announced the selection of six sites that will host the first European quantum computers: Czechia, Germany, Spain, France, Italy, and Poland.

Lenovo announced the new all-in-one VR headset engineered for the enterprise.

AMD unveiled the new Ryzen 7020 Series and Athlon 7020 Series Processor lineup.

European telecom operators Deutsche Telekom, Orange, Telefónica, and Vodafone, together with the deep tech company MATSUKO, have conducted a pilot to make holographic calls as easy and simple as making a straightforward phone call.

Arm, Intel, and Nvidia have jointly authored a paper describing an 8-bit floating point (FP8) specification and its two variants E5M2 and E4M3.

Intel and Broadcom showcased the industry’s first cross-vendor Wi-Fi 7 demonstration, with over-the-air speeds greater than 5 gigabits per second.

Siemens Mobility and Deutsche Bahn presented the H2goesRail project to the public in November 2020.