Siemens simplified the drafting and production of 2.5D and 3D integrated circuit (IC) designs typically used for high-bandwidth memory functions.

Rimac Technology engineered, designed, and seamlessly integrated the battery system, e-axles, and electronic control units for the Bugatti Tourbillon hyper-sports cars.

Lenovo announced it would build a High Performance Computing (HPC) system for the IEO Monzino Group.

NVIDIA announced that the JUPITER supercomputer, powered by the Grace Hopper platform, is the fastest in Europe.

IBM unveiled its path to build the world's first large-scale, fault-tolerant quantum computer.

Nokia has been selected to lead PROACTIF, a project funded by the European Union’s Chips Joint Undertaking.

Huawei is working with Semiconductor Manufacturing International Corp (SMIC) on an advanced 3nm chip.

Nokia launched two new Wi-Fi 7 gateways designed to deliver reliable, ultra-fast broadband to every corner of the home.

Microsoft presented a vision for AI agents from different companies to work together through open standards.

Qualcomm announced the Snapdragon 7 Gen 4 mobile chipset, an evolution in its offerings for mobile platforms.

AMD announced that its next-generation EPYC processor, codenamed “Venice,” is the first HPC product in the industry to be taped out and brought up on the TSMC advanced 2nm (N2) process technology.

Optical communications networks are undergoing a transformative phase, driven by the dual demands for increased connectivity and real-time data acquisition.

Researchers at Deutsche Telekom Innovation Laboratories (T-Labs), together with the quantum networking company Qunnect, have reached a milestone on the path to the quantum internet.

The collaboration between the ACO and the H24Project for emission-free competitions is strengthened by the latest partnership with Bosch Motorsport.

French-based quantum computing specialist Pasqal announced a new technical integration with NVIDIA.

With a new metal 3D printer at its Nuremberg plant, Bosch wants to bolster its pioneering role in the supplier industry.

The Basque Government and IBM announced plans to install Europe's first IBM Quantum System Two.

Meta Platforms started testing its first in-house AI training chip. 

Qualcomm unveiled a new generation of its 5G modem-RF chipset.