At the European Congress of Radiology, Samsung showcased its latest diagnostic imaging medical equipment and AI-based solutions.
Intel, Alibaba, Cisco, Dell EMC, Facebook, Google, HPE, Huawei and Microsoft announced the founding of a consortium to develop Compute Express Link.
IBM researchers have created a new technology called VolCat, a catalytic chemical process that can turn PET into a renewable resource.
Samsung announced that it has begun mass producing the industry’s first 512-gigabyte embedded Universal Flash Storage 3.0 for next-generation mobile devices.
IBM unveiled a new scientific milestone, announcing its highest quantum volume to date.
Intel announced that it contributed the protocol specification to the USB Promoter Group, enabling other chip makers to build compatible silicon, royalty-free.
At MWC19 in Barcelona, Huawei showcased the 5G CPE Pro, the CPE (Customer Premise Equipment) that provides ultra-high speed broadband and intelligent Dual-Link features.
SEAT and IBM announced the development of a new solution designed to transform driving in cities.
Zyxel announced the expansion of its Fixed Wireless Access and In-Building Solutions.
Intel announced it will provide technology to internet services provider Rakuten for a new cloud-native network.
IBM announced a new chapter in the journey from AI experimentation to wide-scale deployment and industry transformation.
Samsung introduced its smallest high-resolution image sensor, the ISOCELL Slim 3T2. The chip is expected to be in mass production in the first quarter of this year.
In partnership with Arsenal FC, Liverpool FC and Manchester City, Intel will deliver immersive experiences via True View at Emirates Stadium, Anfield and the Etihad Stadium.
Samsung announced that it has begun mass producing the industry’s first one-terabyte embedded Universal Flash Storage (eUFS) 2.1, for use in next-generation mobile applications.
Juniper Research has drawn up a list of predictions for 2019, all neatly wrapped up as the top trends for the technology industry.
Samsung introduced its latest innovations in modular Micro LED display technology during its annual First Look CES event.
At CES in Las Vegas, Intel made several announcements spanning PCs and new devices to diverse growth segments including AI, 5G and autonomous driving.
At CES, Bosch Sensortec announced the BML100PI, an Interactive Projection Module that enriches smart homes with a virtual touchscreen on every surface, turning ordinary shelves into personal assistants.
Huawei announced the industry's highest-performance ARM-based CPU, Kunpeng 920.
Qualcomm announced its next-generation modem purpose-built for IoT applications.
Moscow government is launching a smart district that will become a living lab for piloting smart technologies in the city.
This year, according to Bitkom, some 70 percent of Germans will be giving digital gifts.
Intel collaborated with two departments of transportation in the U.S. to improve bridge inspections.
Qualcomm unveiled the Snapdragon 8cx Compute Platform, the world’s first 7 nanometer PC platform.
Intel introduced the new version of their Neural Compute Stick.
Samsung Electronics introduced two new 0.8-micrometer pixel image sensors: the 48-megapixel ISOCELL Bright GM1 and the 32Mp ISOCELL Bright GD1.
Siemens announced a new Additive Manufacturing (AM) Process Simulation solution for predicting distortion during 3D printing.
Bosch is putting the world’s first curved instrument cluster in the cockpit of a mass-production vehicle.
Bosch in North America and Astrobotic Technology announced a research partnership to send experimental sensor technology to the International Space Station (ISS) as early as May 2019.
Bosch supports service technicians by means of innovative Augmented Reality applications.
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