Telia and Ericsson have transitioned 6G development from laboratory environments into active field trials of the technology.

IBM, in collaboration with Siemens, has announced new research intended to advance nanostack architecture, a novel transistor framework introduced earlier this year.

Microsoft has unveiled the third generation of its proprietary AI silicon, the Maia 300.

Google has announced plans to deploy a selection of its artificial intelligence processors into orbit this week.

A coalition including Volvo, Daimler Truck, Toyota, Bosch, Air Liquide, TotalEnergies, TEAL Mobility, and MB Energy announced strategies to accelerate the implementation of hydrogen-powered vehicles across Europe.

At its annual Apsara conference, Alibaba introduced a suite of new Qwen AI models alongside what it called China’s most powerful AI processor and an agentic smartphone solution.

Qualcomm has introduced its latest flagship mobile platforms, which the company asserts will facilitate a wide array of intelligent capabilities.

The United Kingdom Atomic Energy Authority (UKAEA) and the Princeton Plasma Physics Laboratory (PPPL) have agreed to link their respective supercomputing platforms to accelerate the development of fusion energy through the use of AI.

Xiaomi has introduced its new Xring O3 smartphone processor, a move that highlights the Chinese manufacturer’s continued efforts to decrease its dependence on third-party chip suppliers.

OpenAI has just unveiled benchmark data for "Jalapeno," its custom inference chip developed with Broadcom.

Anthropic confirmed it is building an in-house silicon team to design custom chips for its Claude AI model.

Equipped with a fuel-cell power module (FCPM) from Bosch, an Irizar bus has been transporting passengers through the Spanish capital for several weeks now.

Converting a conventional data center into AI-ready infrastructure requires several times more electrical power, liquid cooling, and substantially greater structural load capacity.

Samsung added three new foldable smartphones to its lineup at the Galaxy Unpacked event in London.

Samsung announced redesigned screen technology intended to cut crease visibility and improve the durability of foldable smartphones.

A1 teamed up with Nokia and weather forecast service Skyfora to detect interference affecting Global Navigation Satellite Systems (GNSS) through sensors.

IBM unveiled a major semiconductor breakthrough with the introduction of the world’s first sub-1-nanometer (nm) chip technology, featuring a revolutionary transistor architecture at the 0.7 nm, or 7 angstrom, node.

Samsung developed the industry’s fastest Universal Flash Storage (UFS) 5.0 solution, which will help enable seamless and highly efficient AI services on future mobile devices.

NVIDIA powers more than 400 of the world’s 500 fastest supercomputers, 81% of the TOP 500, according to the latest rankings.