Huawei is working with Semiconductor Manufacturing International Corp (SMIC) on an advanced 3nm chip. The Chinese tech giant is preparing to send the design to China’s largest chipmaker in 2026.
The company, severely hit by the US sanctions, is shifting to a gate-all-around (GAA) architecture, which is used by Samsung Foundry, and moving away from traditional silicon designs. It is developing a so-called carbon-based 3nm design, featuring carbon nanotubes and two-dimensional materials. The company completed lab validation of the 3nm chip, which is currently undergoing production line adaptation at SMIC.
The joint R&D initiative clearly demonstrates that US trade sanctions have failed to halt China’s efforts to create a viable domestic chip sector capable of producing advanced products. Nvidia CEO Jensen Huang recently acknowledged the gap between US and Chinese chips is narrowing, and called attempts by the US to restrict the export of AI chips to China a failure.
Most organizations today understand that a cyberattack is not just a technical incident, but a serious business problem. However, there is still a wide gap between awareness of threats and actual operational readiness.
Meta Platforms unveiled two models of Ray-Ban prescription smart glasses in the US.
The telecom industry is entering a phase in which quantum security is no longer a laboratory topic but an operational and strategic issue for networks, supply chains, and regulation.
