Intel Launched First Hybrid Processors
Intel launched Core processors with Hybrid Technology, code-named Lakefield. Leveraging Foveros 3D packaging technology and featuring a hybrid CPU architecture for power and performance scalability, Lakefield processors are the smallest to deliver Intel Core performance and full Windows compatibility for ultra-light and innovative form factors.
“Core processors with Intel Hybrid Technology are the touchstone of Intel’s vision for advancing the PC industry by taking an experience-based approach to designing silicon with a unique combination of architectures and IPs. Combined with Intel’s deepened co-engineering with our partners, these processors unlock the potential for innovative device categories of the future,” said Chris Walker, Intel corporate vice president and general manager of Mobile Client Platforms.
Core processors with Intel Hybrid Technology deliver full Windows 10 application compatibility in up to a 56% smaller package area for up to 47% smaller board size and extended battery life. The company says that this will give OEMs more flexibility in form factor design across single, dual and foldable screen devices while delivering the PC experiences people expect.
They are also the first Core processors shipping with attached package-on-package (PoP) memory, further reducing board size. They will also be the first to deliver as low as 2.5mW of standby SoC power, an up to 91% reduction compared to Y-series processors. New processors will also feature native dual internal display pipes, making them suited for foldable and dual-screen PCs. Two announced designs powered by the processors with hybrid technology include the Lenovo ThinkPad X1 Fold and the Samsung Galaxy Book S that is expected in select markets this month.