Qualcomm Unveils AI and Connectivity Innovations at MWC

Qualcomm Unveils AI and Connectivity Innovations at MWC
Dražen Tomić / Tomich Productions

At MWC Barcelona, Qualcomm announced its latest on-device AI, intelligent computing, and wireless connectivity products and milestones. Those solutions are poised to accelerate digital transformation, drive a new wave of economic growth, and bring the convergence of AI and connectivity to new regions.

AI Hub features a new library of 75+ pre-optimized AI models for seamless deployment on devices powered by Snapdragon and Qualcomm platforms. Developers can seamlessly integrate these models into their applications, reducing time-to-market and unlocking the benefits of on-device AI implementations such as immediacy, reliability, privacy, personalization, and cost savings. These models are available on the AI Hub, Hugging Face, and GitHub. Developers will be able to run the models themselves with a few lines of code on cloud-hosted devices powered by Qualcomm platforms.

Snapdragon X80 5G Modem-RF System is the world’s most advanced 5G modem-to-antenna platform. The X80 architecture integrates 5G-Advanced capabilities and is the first modem with fully integrated NB-NTN satellite communications support for connectivity to non-terrestrial networks. A dedicated tensor accelerator powers AI optimization that improves throughput, quality of service (QoS), coverage, latency, spectrum efficiency, power efficiency, and mmWave beam management.

FastConnect 7900  mobile connectivity system is the first to deliver AI-optimized performance and integrate Wi-Fi 7, Bluetooth, and Ultra Wideband technologies in a single chip. Utilizing AI, FastConnect 7900 adapts to specific use cases and environments, delivering meaningful optimizations across power consumption, network latency, and throughput. FastConnect 7900 integrates Ultra Wideband technology, Wi-Fi Ranging, and Bluetooth Channel Sounding to create a powerful suite of proximity technologies that enable secure device discovery, access, and control.

“The future of generative AI is hybrid, with on-device intelligence working together with the cloud to provide greater personalization, privacy, reliability, and efficiency. Connectivity is critical to help generative AI scale and extend across the cloud, edge, and device, and AI solutions are enabling us to deliver next-gen connectivity that can support this era of Generative AI,” said Cristiano Amon, president and CEO of Qualcomm. “As the company driving intelligent computing everywhere, we are enabling the ecosystem to develop and commercialize generative AI use cases, experiences, and leading products across device categories, including smartphones, next-gen PCs, XR devices, vehicles, robotics, and more.”