Canon Ships Its First New Chipmaking Machine
Canon shipped its brand-new lithography system for chip manufacturing to a Texas-based semiconductor consortium.
Qualcomm unveiled the Snapdragon 7s Gen 3 mobile chipset. It is designed to bring some of the higher-end functions of its Snapdragon 7 series into a wider range of mid-tier devices.
The chipset includes GenAI capabilities compatible with large language models Baichuan-7B and Llama 2. Unlike the Snapdragon 7+ Gen 3 chip, it has no room for Gemini Nano. Akash Sharma, director of product management at Qualcomm, said that an improved engine means the Snapdragon 7s Gen 3 features a 30% increase in AI performance over its predecessor. “The goal is to make generative AI, along with improved traditional AI, accessible on more devices,” he explained.
Qualcomm stated its Kyro CPU 64-bit architecture improves performance by nearly 20%. There is a 40% rise in GPU performance and an overall 12% boost in battery life. It features a 200MP camera module with a 12-bit triple ISP and 4K HDR video capture. The chip is compatible with mmWave and sub-6GHz bands, delivering peak data rates of up to 2Gb/s in the downlink. Sharma said Xiaomi will be the first OEM to use the new chip, starting in September, followed by Realme, Sharp, and Samsung.