Samsung Showcased Its Latest Silicon Technologies
Samsung showcased advanced memory and system logic devices at its Tech Day 2019 event. The company unveiled the Exynos 990 premium mobile processor, the 5G-enabled Exynos Modem 5123 and announced mass production of its third generation 10nm-class 1z-nm DRAM.
“Samsung is focused on harnessing the most advanced semiconductor technologies to power innovation across key markets,” said JS Choi, president, Samsung Semiconductor. “From System LSI devices that are perfectly adapted for real-world 5G and AI, to advanced solid-state drives (SSDs) that handle mission-critical tasks and offload CPU workload, we are determined to deliver infrastructure capabilities that are built to enable every wave of innovation.”
Exynos 990 and 5G Exynos Modem 5123 deliver AI-powered user experience on-device with a dual-core neural processing unit (NPU) and enhanced digital signal processor (DSP) that can perform over ten-trillion operations per second. The Exynos 990 and 5G Exynos Modem 5123 are made in a 7-nanometer (nm) process using extreme ultraviolet (EUV) lithography.
Third-generation 10nm-class (1z-nm) DRAM delivers high performance, energy efficiency and capacity, and its mass production started in September. Optimized for premium server platform development, the 1z-nm DRAM will open the door to a lineup of memory solutions such as DDR5, LPDDR5, HBM2E and GDDR6 products as early as the beginning of next year. 12GB LPDDR4X uMCP combines four 24Gb LPDDR4X chips and a fast eUFS 3.0 NAND storage into a single package, breaking through the current 8GB package limit in mid-range smartphones and bringing more than 10GB of memory to the broader smartphone market.