Siemens has signed an agreement to acquire UltraSoC Technologies, a provider of instrumentation and analytics solutions. Siemens plans to integrate UltraSoC’s technology into the Xcelerator portfolio as part of Mentor’s Tessent software product suite.
The addition of UltraSoC to Siemens enables a unified data-driven infrastructure that can enhance product quality, safety and cybersecurity, and the creation of a comprehensive solution to help semiconductor industry customers overcome key pain points including manufacturing defects, software and hardware bugs, device early-failure and wear-out, functional safety, and malicious attacks.
“Siemens’ acquisition of UltraSoC means that for the first time our customers can access not just design-for-test, but a comprehensive ‘Design for Lifecycle Management’ solution for system-on-chips, including functional safety, security and optimization,“ says Brady Benware, Tessent Vice President and General Manager, Siemens Digital Industries Software. “By utilizing design augmentation to detect, mitigate and eliminate risks throughout the SoC lifecycle, customers can radically improve time-to-revenue, product quality & safety, and profitability.“
UltraSoC‘s products are widely used in the automotive, high-performance computing, storage and semiconductor industries. The company was recently selected as a participant in the DARPA AISS (Automatic Implementation of Secure Silicon) program; and is a member of the Secure-CAV consortium, an ambitious collaborative project that aims to improve the safety and security of tomorrow’s connected and autonomous vehicles (CAVs). Siemens’ acquisition of UltraSoC is due to close in the fourth quarter of Siemens’ fiscal year 2020. Terms of the transaction were not disclosed.
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Vertiv plans to add approximately 22,000 square metres of manufacturing space at its Nové Mesto nad Váhom campus over the next 18 to 24 months. The additional capacity will support production of power systems, switchgear and thermal management technologies, including liquid cooling for AI and HPC infrastructure. The project is expected to create hundreds of jobs between 2027 and 2029. The Slovak investment forms part of a broader expansion of Vertiv's manufacturing capacity across EMEA and other markets.