Qualcomm announced a lot of news at its Snapdragon Summit this week.

Rimac Technology unveiled its latest portfolio of advanced battery and powertrain technologies at IAA Mobility 2025 in Munich, including next-generation solid-state solutions and evolutions of its current batteries and e-Axles.

The new JUPITER supercomputer, inaugurated at Forschungszentrum Jülich in Germany, has officially become the first European system to achieve the exascale threshold.

Qualcomm unveiled its Snapdragon 7s Gen 4 mobile chipset for mid-range devices.

Canadian fitness technology company Form unveiled AR Smart Swim 2 Pro goggles.

Japanese startup chipmaker Rapidus started prototyping a 2nm gate-all-around (GAA) transistor at its brand-new fabrication facility.

Vodafone Group and the University of Malaga will jointly develop a new generation of mobile signal technology using photonic computer chips.

By the end of 2027, Bosch will invest more than €2.5 billion in the application and development of artificial intelligence.

Siemens simplified the drafting and production of 2.5D and 3D integrated circuit (IC) designs typically used for high-bandwidth memory functions.

Rimac Technology engineered, designed, and seamlessly integrated the battery system, e-axles, and electronic control units for the Bugatti Tourbillon hyper-sports cars.

Lenovo announced it would build a High Performance Computing (HPC) system for the IEO Monzino Group.

NVIDIA announced that the JUPITER supercomputer, powered by the Grace Hopper platform, is the fastest in Europe.

IBM unveiled its path to build the world's first large-scale, fault-tolerant quantum computer.

Nokia has been selected to lead PROACTIF, a project funded by the European Union’s Chips Joint Undertaking.

Huawei is working with Semiconductor Manufacturing International Corp (SMIC) on an advanced 3nm chip.

Nokia launched two new Wi-Fi 7 gateways designed to deliver reliable, ultra-fast broadband to every corner of the home.

Microsoft presented a vision for AI agents from different companies to work together through open standards.

Qualcomm announced the Snapdragon 7 Gen 4 mobile chipset, an evolution in its offerings for mobile platforms.

AMD announced that its next-generation EPYC processor, codenamed “Venice,” is the first HPC product in the industry to be taped out and brought up on the TSMC advanced 2nm (N2) process technology.