Samsung Begins Mass Production of the Thinnest DRAM

Samsung has begun mass production for the industry’s thinnest 12 nm-class, 12GB, and 16GB LPDDR5X DRAM packages. Ultra-slim DRAM packages can create additional space within mobile devices, facilitating better airflow. This supports easier thermal control, a factor that is becoming increasingly critical, especially for high-performance applications with advanced features such as on-device AI.

“Samsung’s LPDDR5X DRAM sets a new standard for high-performance on-device AI solutions, offering not only superior LPDDR performance but also advanced thermal management in an ultra-compact package,” said YongCheol Bae, Executive Vice President of Memory Product Planning at Samsung. “We are committed to continuous innovation through close collaboration with our customers, delivering solutions that meet the future needs of the low-power DRAM market.”

With the new LPDDR5X DRAM packages, Samsung offers the industry’s thinnest 12 nm-class LPDDR DRAM in a 4-stack structure, reducing the thickness by approximately 9% and improving heat resistance by about 21.2%, compared to the previous generation product. By optimizing PCB and EMC techniques, the new package is as thin as a fingernail at 0.65 mm, the thinnest among existing LPDDR DRAMs of 12GB or above. Samsung’s optimized back-lapping process is also used to minimize the package height.