Qualcomm unveiled its new chipset platform for flagship smartphones, the Snapdragon 888. The new chip is focusing on enhanced AI capabilities, improved ability to support high-end gaming and advanced image processing features.
“Qualcomm’s history of breakthrough technology inventions has paved the way for our continued leadership in the premium-tier mobile segment,“ said Alex Katouzian, senior vice president and general manager of mobile, compute and infrastructure at Qualcomm. “The new flagship Snapdragon 888 will enable OEMs to further differentiate their devices and allows users to experience the latest cutting-edge mobile technologies.“
Snapdragon 888 uses the third generation of its X60 5G Modem-RF System compatible with global bands for non-standalone and standalone operation. It also offers carrier aggregation, global multi-SIM and Dynamic Spectrum Sharing capabilities. Qualcomm highlighted that the new platform provides improvements in key areas including significant upgrades in GPU performance to aid gaming; improved image capture speeds; and a completely re-engineered AI engine Qualcomm said was a pivotal leap forward.
Rimac Technology unveiled its latest portfolio of advanced battery and powertrain technologies at IAA Mobility 2025 in Munich, including next-generation solid-state solutions and evolutions of its current batteries and e-Axles.
The new JUPITER supercomputer, inaugurated at Forschungszentrum Jülich in Germany, has officially become the first European system to achieve the exascale threshold.
Qualcomm unveiled its Snapdragon 7s Gen 4 mobile chipset for mid-range devices.
