At the MWC in Barcelona, Qualcomm held more than 10 product and solutions demonstrations. The company illustrated innovations and expanded capabilities to Snapdragon 5G Modem-RF Systems and 5G RAN Platforms for increasing 5G performance, coverage, and power efficiency.
“Since the launch of the first commercial 5G devices and networks three years ago, Qualcomm has delivered most innovative chipset products for advancing the intelligent, immersive, and intuitive 5G mobile experiences users deserve,“ said Durga Malladi, Senior Vice President and General Manager for 5G, Mobile Broadband and Infrastructure at Qualcomm. “Our latest advancements and new capabilities within the industry-leading Snapdragon 5G Modem-RF Systems and Qualcomm 5G RAN Platforms will continue to make 5G more robust and more adept to power not only the latest smartphones, but also home internet connectivity, PCs, industrial equipment, and more.“
Qualcomm's latest 5G product demonstrations underscore the Company’s delivery on its One Technology Roadmap and commitment to driving the rapid commercialization of new 5G capabilities through its industry-leading portfolio of chipsets for devices and networks. Snapdragon X70 illustrates the advancements in 5G+AI, expanded mmWave configurations, spectrum aggregation, and global multi-SIM. The company demonstrated its advancements in cooperation with its numerous partners.
The Fédération Internationale de l'Automobile (FIA) has selected Siemens as “Official Digital Twin Sponsor”, as the global governing body for motor sport and federation for mobility organizations worldwide expands its use of Siemens software.
Infobip has surpassed 10 billion Rich Communication Services (RCS) business messages, delivered to consumers on its platform, marking a significant leap toward richer, conversational messaging.