Thirteen years ago, on 4th of February, ICTbusiness.info was launched with a clear idea – to create a medium that would follow technology, digital transformation, and the ICT industry in a serious, analytical, and long-term manner. At the time, however, we did not know that it would expand and reach what it is today.
Microsoft introduced a second-generation AI chip to improve the efficiency of its services.
Qualcomm unveiled several product updates alongside the launches of new products ahead of the official opening of CES 2026.
Qualcomm added its latest smartphone platform to its premium-tier Snapdragon range.
Cisco and IBM set a target for a proof-of-concept of large-scale networking technology for quantum computing.
According to information available today, November 18, 2025, Cloudflare, a vital provider of Internet infrastructure and security, experienced a massive global service outage that resulted in widespread failure to access countless online services. The incident began around 11:20 GMT (12:20 CET), causing a global wave of disruption that affected key digital platforms across North America, Europe, and Asia.
After officially launching Hybrion proton exchange membrane (PEM) in March, Bosch has now put two of them into operation in an electrolyzer at its Bamberg site.
According to media reports, Samsung decided to use its Exynos 2600 chip across the Galaxy S26 series in selected markets.
Samsung announced its new extended reality headset, the Galaxy XR.
ETSI is turning towards quantum computing solutions.
Qualcomm announced a lot of news at its Snapdragon Summit this week.
Rimac Technology unveiled its latest portfolio of advanced battery and powertrain technologies at IAA Mobility 2025 in Munich, including next-generation solid-state solutions and evolutions of its current batteries and e-Axles.
The new JUPITER supercomputer, inaugurated at Forschungszentrum Jülich in Germany, has officially become the first European system to achieve the exascale threshold.
Qualcomm unveiled its Snapdragon 7s Gen 4 mobile chipset for mid-range devices.
Canadian fitness technology company Form unveiled AR Smart Swim 2 Pro goggles.
Japanese startup chipmaker Rapidus started prototyping a 2nm gate-all-around (GAA) transistor at its brand-new fabrication facility.
Vodafone Group and the University of Malaga will jointly develop a new generation of mobile signal technology using photonic computer chips.
By the end of 2027, Bosch will invest more than €2.5 billion in the application and development of artificial intelligence.
Siemens simplified the drafting and production of 2.5D and 3D integrated circuit (IC) designs typically used for high-bandwidth memory functions.
Rimac Technology engineered, designed, and seamlessly integrated the battery system, e-axles, and electronic control units for the Bugatti Tourbillon hyper-sports cars.
